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features ? fully compliant to irda 1.0 physical layer specifications C 9.6 kb/s to 115.2 kb/s operation ? typical link distance > 1.5 m ? iec825-class 1 eye safe ? low power operation range C 2.7 v to 5.25 v ? small module size C 4.0 x 12.2 x 5.1 mm (hxwxd) ? complete shutdown C txd, rxd, pin diode ? low shutdown current C 10 na typical ? adjustable optical power management C adjustable led drive-current to maintain link integrity ? integrated emi shield C excellent noise immunity ? edge detection input C prevents the led from long turn-on time ? interface to various super i/o and controller devices ? designed to accommodate light loss with cosmetic window ? only 2 external components are required applications ? digital imaging C digital still cameras C photo-imaging printers ? data communication C notebook computers C desktop pcs C win ce handheld products C personal digital assistants (pdas) C printers C fax machines, photocopiers C screen projectors C auto pcs C dongles C set-top box ? telecommunication products C cellular phones C pagers ? small industrial & medical instrumentation C general data collection devices C patient & pharmaceutical data collection devices functional block diagram agilent hsdl-3612 irda ? data compliant 115.2 kb/s 3 v to 5 v infrared transceiver data sheet description the hsdl-3612 is a low-profile infrared transceiver module that provides interface between logic and ir signals for through-air, serial, half-duplex ir data link. the module is compliant to irda data physical layer specifications 1.4 and iec825-class 1 eye safe. txd (9) md0 (4) md1 (5) gnd (7,3) agnd (2) v cc (1) r1 v cc sp hsdl-3612 cx1 cx2 leda (10) rxd (8)
2 the hsdl-3612 contains a high- speed and high-efficiency 870 nm led, a silicon pin diode, and an integrated circuit. the ic contains an led driver and a receiver providing a single output (rxd) for all data rates supported. the hsdl-3612 can be completely shut down to achieve very low power consumption. in the shut down mode, the pin diode will be inactive and thus producing very little photo- current even under very bright ambient light. the hsdl-3612 also incorporated the capability for adjustable optical power. with two programming pins; mode 0 and mode 1, the optical power output can be adjusted lower when the nominal desired link distance is one-third or two-third of the full irda link. the hsdl-3612 front view options (HSDL-3612-007/-037) and a top view packaging option (hsdl-3612-008/-038) come with integrated shield that helps to ensure low emi emission and high immunity to emi field, thus enhancing reliable performance. application support information the application engineering group is available to assist you with the technical understanding associated with hsdl-3612 infrared transceiver module. you can contact them through your local sales representatives for additional details. ordering information package option package part number standard package increment front view HSDL-3612-007 400 front view hsdl-3612-037 1800 top view hsdl-3612-008 400 top view hsdl-3612-038 1800
3 i/o pins configuration table pin description symbol 1 supply voltage v cc 2 analog ground agnd 3 ground gnd 4 mode 0 md0 5 mode 1 md1 6 no connection nc 7 ground gnd 8 receiver data output rxd 9 transmitter data input txd 10 led anode leda 87654321 9 10 back view (HSDL-3612-007/-037) transceiver i/o truth table transceiver inputs outputs mode txd ei led rxd active 1 x on not valid active 0 high [1] off low [2] active 0 low off high shutdown x [3] low not valid not valid x = dont care ei = in-band infrared intensity at detector notes: 1. in-band el 115.2 kb/s. 2. logic low is a pulsed response. the condition is maintained for duration dependent on the pattern and strength of the incident intensity. 3. to maintain low shutdown current, txd needs to be driven high or low and not left floating. transceiver control truth table mode 0 mode 1 rx function tx function 1 0 shutdown shutdown 0 0 sir full distance power 0 1 sir 2/3 distance power 1 1 sir 1/3 distance power 87654321 9 10 bottom view (hsdl-3612-008/-038)
4 recommended application circuit components component recommended value r1 6.2 w 5%, 0.5 watt, for 2.7 v cc 3.6 v operation 15.0 w 5%, 0.5 watt, for 4.75 v cc 5.25 v operation cx1 [4] 0.47 m f 20%, x7r ceramic cx2 [5] 6.8 m f 20%, tantalum notes: 4. cx1 must be placed within 0.7 cm of the hsdl-3612 to obtain optimum noise immunity. 5. in "hsdl-3612 functional block diagram" on page 1 it is assumed that vled and v cc share the same supply voltage and filter capacitors. in case the 2 pins are powered by different supplies cx2 is applicable for vled and cx1 for v cc . in environments with noisy power supplies, including cx2 on the v cc line can enhance supply rejection performance. iled (a) 0.7 leda voltage (v) 0.3 1.7 2.1 0 0.1 1.3 2.3 0.5 1.5 1.9 0.6 0.4 0.2 iled vs. leda. light output power (lop) vs. iled. marking information the HSDL-3612-007/-037 is marked 3612yyww on the shield where yy indicates the units manufacturing year, and ww refers to the work week in which the unit is tested. lop (mw/sr) 200 iled (ma) 80 120 270 0 20 0 300 160 30 150 180 120 40 100 60 90 180 60 210 240 140 cautions: the bicmos inherent to the design of this component increases the components susceptibility to damage from electrostatic discharge (esd). it is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by esd.
5 absolute maximum ratings [6] parameter symbol minimum maximum unit conditions storage temperature t s C40 +100 c operating temperature t a C20 +70 c dc led current i led (dc) 165 ma peak led current i led (pk) 750 ma 2 m s pulse width, 10% duty cycle led anode voltage v leda C0.5 7 v supply voltage vcc 0 7 v transmitter data i txd (dc) C12 12 ma input current receiver data v o C0.5 vcc+0.5 v |i o (rxd)| = 20 m a output voltage note: 6. for implementations where case to ambient thermal resistance 50 c/w. recommended operating conditions parameter symbol minimum maximum unit operating temperature t a C20 +70 c supply voltage v cc 2.7 5.25 v logic high input voltage v ih 2 v cc /3 v cc v for txd, md0, md1, and fir_sel logic low transmitter input voltage v il 0 v cc /3 v led (logic high) current pulse amplitude i leda 180 300 ma receiver signal rate 2.4 115.2 kb/s
6 electrical & optical specifications specifications hold over the recommended operating conditions unless otherwise noted. unspecified test conditions can be anywhere in their operating range. all typical values are at 25 c and 3.3 v unless otherwise noted. parameter symbol min. typ. max. unit conditions transceiver supply shutdown i cc1 10 200 na v i (txd) v il or current v i (txd) 3 v ih idle i cc2 2.5 5 ma v i (txd) v il , ei = 0 digital input logic i l/h C1 1 m a0 v i v cc current low/high transmitter transmitter logic high ei h 50 120 400 mw/sr v ih = 3.0 v radiant intensity i leda = 200 ma intensity q 1/2 15 peak l p 875 nm wavelength spectral dl 1/2 35 nm line half width viewing angle 2 q 1/2 30 60 optical pulse tpw (ei) 1.5 1.6 1.8 m s tpw(txd) = 1.6 m s at width 115.2 kb/s rise and fall t r (ei), 40 ns tpw(txd) = 1.6 m s at times t f (ei) 115.2 kb/s t r/f (txd) = 10 ns maximum tpw (max) 20 50 m s txd pin stuck high optical pulse width led anode v on (leda) 2.4 v i leda = 200 ma, on state voltage v i (txd) 3 v ih led anode i lk (leda) 1 100 na v leda = v cc = 5.25 v, off state leakage current v i (txd) v il
7 electrical & optical specifications specifications hold over the recommended operating conditions unless otherwise noted. unspecified test conditions can be anywhere in their operating range. all typical values are at 25 c and 3.3 v unless otherwise noted. parameter symbol min. typ. max. unit conditions receiver receiver logic low [7] v ol 0 - 0.4 v i ol = 1.0 ma, data output ei 3 3.6 m w/cm 2 , voltage q 1/2 15 logic high v oh v cc C 0.2 - v cc vi oh = C20 m a, ei 0.3 m w/cm 2 , q 1/2 15 viewing angle 2 q 1/2 30 logic high receiver input ei h 0.0036 500 mw/cm 2 for in-band signals irradiance 115.2 kb/s [8] logic low receiver input ei l 0.3 m w/cm 2 for in-band signals [8] irradiance receiver peak sensitivity l p 880 nm wavelength receiver sir pulse width tpw (sir) 1 4.0 m s q 1/2 15 [9] , c l = 10 pf receiver latency time t l 20 50 m s receiver rise/fall times t r/f (rxd) 25 ns receiver wake up time t w 100 m s [10] notes: 7. logic low is a pulsed response. the condition is maintained for duration dependent on pattern and strength of the incident intensity. 8. an in-band optical signal is a pulse/sequence where the peak wavelength, lp, is defined as 850 lp 900 nm, and the pulse characteristics are compliant with the irda serial infrared physical layer link specification. 9. for in-band signals 115.2 kb/s where 3.6 m w/cm 2 ei 500 mw/cm 2 . 10. wake up time is the time between the transition from a shutdown state to an active state and the time when the receiver is active and ready to receive infrared signals.
8 rxd output waveform led optical waveform receiver wake up time definition (when md0 p 1 and md1 p 0) t f v oh 90% 50% 10% v ol t pw t r t f led off 90% 50% 10% led on t pw t r rx light t w rxd valid data t pw (max.) txd led txd stuck on protection
9 HSDL-3612-007 and hsdl3612-037 package outline with dimension and recommended pc board pad layout pin 1 mounting center 6.10 4.18 4.00 12.20 3.84 r 1.77 r 2.00 4.05 4.95 10 castellation: pitch 1.1 ?0.1 cumulative 9.90 ?0.1 0.70 0.80 1.70 pin 10 0.45 1.20 0.80 2.45 1.90 3.24 1.90 4.98 mid of land 1.05 2.40 2.35 2.84 2.08 0.70 0.43 pin 10 pin 1 mounting center top view front view land pattern back view side view all dimensions in millimeters (mm). dimension tolerance is 0.20 mm unless otherwise specified. 1.17 pin 1 2 3 4 5 v cc agnd gnd md0 md1 pin 6 7 8 9 10 nc gnd rxd txd leda function function
10 hsdl-3612-008 and hsdl3612-038 package outline with dimension and recommended pc board pad layout 3.85 0.47 0.36 0.83 0.42 0.94 0.31 0.84 0.53 0.31 0.28 1.77 2.15 +0.05 - 0.00 12.2 +0.10 - 0.00 4.16 +0.05 - 0.00 11.7 +0.05 - 0.00 2.5 5 11.7 0.85 0.3 2.08 1.46 2.57 3.84 3.24 5 5 2.08 r2.3 r2.1 0.1 0.1 4.65 r2 r1.77 0.8 0.73 0.94 1.95
11 tape and reel dimensions (HSDL-3612-007, -037) 12.50 ?0.10 8.00 ?0.10 4.00 ?0.10 24.00 ?0.30 1.75 ?0.10 0.40 ?0.10 4.25 ?0.10 ? 1.55 ?0.05 11.50 ?0.10 2.00 ?0.10 b b 5?(max.) 5?(max.) 5.20 ?0.10 aa section a-a section b-b 10 3.8 a a ? 1.5 ?0.1 10 11 12 8 7 3 2 1 4 5 6 4.4 9 a a a all dimensions in millimeters (mm) r 1.00 2.00 ?0.50 label empty parts mounted leader empty (400 mm min.) (40 mm min.) direction of pulling (40 mm min.) configuration of tape 13.00 ?0.50 shape and dimensions of reels quantity = 400 pieces per reel (HSDL-3612-007) 1800 pieces per tape (hsdl-3612-037) 21.00 ?0.80
12 tape and reel dimensions (hsdl-3612-008, -038) bo w e t ko f b do p2 d1 po p1 5.4 ?0.15 symbol spec symbol spec ao 4.4 ?0.10 bo 12.50 ?0.10 ko 4.85 ?0.10 po 4.0 ?.10 p1 8.0 ?0.10 p2 2.0 ?0.10 t 0.35 ?0.10 e 1.75 ?0.10 f 11.5 ?0.10 do 1.55 ?0.10 d1 1.5 ?0.10 w 24.0 ?0.3 10po 40.0 ?0.20 b 5?(max.) 5?(max.) aa section a-a notes: 1. i.d. sprocket hole pitch cumulative tolerance is ?0.2 mm. 2. corner camber shall be not more than 1 mm per 100 mm through a length of 250 mm. 3. ao and bo measured on a place 0.3 mm above the bottom of the pocket. 4. ko measured from a place on the inside bottom of the pocket to top surface of carrier. 5. pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. section b-b 8 ?0.10 ao all dimensions in millimeters (mm) r 1.00 2.00 ?0.50 label empty parts mounted leader empty (400 mm min.) (40 mm min.) direction of pulling (40 mm min.) configuration of tape 13.00 ?0.50 shape and dimensions of reels quantity = 400 pieces per reel (hsdl-3612-008) 1800 pieces per tape (hsdl-3612-038) 21.00 ?0.80
13 units in a sealed moisture-proof package package is opened (unsealed) environment less than 30?, and less than 60% rh package is opened less than 72 hours perform recommended baking conditions no baking is necessary yes no no yes baking conditions if the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. package temp. time in reels 60 c 3 48 hours in bulk 100 c 3 4 hours 125 c 3 2 hours 150 c 3 1 hour baking should be done only once. recommended storage conditions storage 10 c to 30 c temperature relative below 60% rh humidity time from unsealing to soldering after removal from the bag, the parts should be soldered within three days if stored at the recom- mended storage conditions. if times longer than 72 hours are needed, the parts must be stored in a dry box. moisture proof packaging all hsdl-3612 options are shipped in moisture proof package. once opened, moisture absorption begins.
14 the reflow profile is a straight- line representation of a nominal temperature profile for a convective reflow solder process. the temperature profile is divided into four process zones, each with different d t/ d time temperature change rates. the d t/ d time rates are detailed in the above table. the temperatures are measured at the component to printed circuit board connections. in process zone p1 , the pc board and hsdl-3612 castellation i/o pins are heated to a temperature of 125 c to activate the flux in the solder paste. the temperature ramp up rate, r1, is limited to 4 c per second to allow for even heating of both the pc board and hsdl-3612 castellation i/o pins. process zone p2 should be of sufficient time duration (> 60 seconds) to dry the solder paste. the temperature is raised to a level just below the liquidus point of the solder, usually 170 c (338 f). process zone p3 is the solder reflow zone. in zone p3, the temperature is quickly raised above the liquidus point of solder to 230 c (446 f) for optimum results. the dwell time above the liquidus point of solder should be between 15 and 90 seconds. it usually takes about 15 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. beyond a dwell time of 90 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. the temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 170 c (338 f), to allow the solder within the connections to freeze solid. process zone p4 is the cool down after solder freeze. the cool down rate, r5, from the liquidus point of the solder to 25 c (77 f) should not exceed -3 c per second maximum. this limitation is necessary to allow the pc board and hsdl-3612 castellation i/o pins to change dimensions evenly, putting minimal stresses on the hsdl-3612 transceiver. reflow profile 0 t-time (seconds) t ?temperature ?(?) 200 170 125 100 50 50 150 100 200 250 300 150 183 230 p1 heat up p2 solder paste dry p3 solder reflow p4 cool down 25 r1 r2 r3 r4 r5 90 sec. max. above 183? max. 245? process zone symbol dt maximum dt/dtime heat up p1, r1 25 c to 125 c4 c/s solder paste dry p2, r2 125 c to 170 c 0.5 c/s p3, r3 170 c to 230 c4 c/s solder reflow (245 c at 10 seconds max.) p3, r4 230 c to 170 c-4 c/s cool down p4, r5 170 c to 25 c-3 c/s
15 appendix a: HSDL-3612-007/-037 smt assembly application note 1.0 solder pad, mask and metal solder stencil aperture 1.1 recommended land pattern for HSDL-3612-007/-037 figure 1.0. stencil and pcba. metal stencil for solder paste printing land pattern pcba stencil aperture solder mask shield solder pad a b f theta 10x pad y d e g rx lens tx lens fiducial x c fiducial figure 2.0. top view of land pattern. dim. mm inches a 2.40 0.095 b 0.70 0.028 c (pitch) 1.10 0.043 d 2.35 0.093 e 2.80 0.110 f 3.13 0.123 g 4.31 0.170
16 1.2 adjacent land keep-out and solder mask areas dim. mm inches h min. 0.2 min. 0.008 j 13.4 0.528 k 4.7 0.185 l 3.2 0.126 adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. there should be no other smd components within this area. h is the minimum solder resist strip width required to avoid solder bridging adjacent pads. it is recommended that 2 fiducial cross be placed at mid- length of the pads for unit alignment. note: wet/liquid photo-imaginable solder resist/mask is recommended. figure 3.0. HSDL-3612-007/-037 pcba C adjacent land keep-out and solder mask. h l rx lens tx lens j solder mask land k y 2.0 recommended solder paste/ cream volume for castellation joints based on calculation and experiment, the printed solder paste volume required per castellation pad is 0.30 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume).
17 allowable misalignment tolerance x C direction 0.2 mm (0.008 inches) theta C direction 2 degrees 2.1 recommended metal solder stencil aperture it is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. this is to ensure adequate printed solder paste volume and no shorting. the following combination of metal stencil aperture and metal stencil thickness should be used: 3.0 pick and place misalignment tolerance and product self- alignment after solder reflow if the printed solder paste volume is adequate, the unit will self- align in the x-direction after solder reflow. units should be properly reflowed in ir hot air convection oven using the recommended reflow profile. the direction of board travel does not matter. see fig 4.0 t, nominal stencil thickness l, length of aperture mm inches mm inches 0.152 0.006 2.8 0.05 0.110 0.002 0.127 0.005 3.4 0.05 0.134 0.002 w, the width of aperture is fixed at 0.70 mm (0.028 inches) aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions figure 4.0. solder paste stencil aperture. aperture as per land dimensions solder paste l w t (stencil thickness)
3.1 tolerance for x-axis alignment of castellation misalignment of castellation to the land pad should not exceed 0.2 mm or approximately half the width of the castellation during placement of the unit. the castellations will completely self- align to the pads during solder reflow as seen in the pictures below. photo 2.0. castellation self-align to land pads after reflow. photo 3.0. unit is rotated before reflow. 3.2 tolerance for rotational (theta) misalignment units when mounted should not be rotated more than 2 degrees with reference to center x-y as specified in fig 2.0. pictures 3.0 and 4.0 show units before and photo 1.0. castellation misaligned to land pads in x-axis before reflow. after reflow. units with a theta misalignment of more than 2 degrees do not completely self align after reflow. units with 2 degree rotational or theta misalignment self-aligned completely after solder reflow. photo 4.0. unit self-aligns after reflow.
3.3 y-axis misalignment of castellation in the y-direction, the unit does not self-align after solder reflow . it is recommended that the unit be placed in line with the fiducial mark (mid-length of land pad.) this will enable sufficient land length (minimum of 1 / 2 land length.) to form a good joint. see fig 5.0. figure 5.0. section of a castellation in y-axis. photo 5.0. good solder joint. minimum 1/2 the length of the land pad lens edge fiducial y 3.4 example of good hsdl-3612- 007/-037 castellation solder joints this joint is formed when the printed solder paste volume is adequate, i.e. 0.30 cubic mm and reflowed properly. it should be reflowed in ir hot-air convection reflow oven. direction of board travel does not matter. 0.8 1.2 0.70 0.425 0.20 0.7 0.4 4.0 solder volume evaluation and calculation geometry of an HSDL-3612-007/ -037 solder fillet.
20 dim. mm inches a 1.95 0.077 b 0.60 0.024 c (pitch) 1.10 0.043 d 1.60 0.063 e 5.70 0.224 f 3.80 0.123 g 2.40 0.170 appendix b: hsdl-3612-008/-038 smt assembly application note 1.0. solder pad, mask, and metal solder stencil aperture metal stencil for solder paste printing land pattern pcba stencil aperture solder mask figure 1. stencil and pcba. 1.1. recommended land pattern for hsdl-3612-008/-038 shield solder pad a b theta 10x pad y d e g tx lens rx lens fiducial x c fiducial h f
21 2.0 y-axis misalignment of castellation in the y-direction, the unit does not self-align after solder reflow. it is recommended that the unit be placed in line with the fiducial mark (mid-length of land pad). this will enable sufficient land length (minimum of 1 / 2 land length) to form a good joint. see figure 2. figure 2. section of a castellation in y-axis. y 1/2 the length of the castellation pad fiducial
22 to ensure irda compliance, some constraints on the height and width of the window exist. the minimum dimensions ensure that the irda cone angles are met without vignetting. the maximum dimensions minimize the effects of stray light. the minimum size corresponds to a cone angle of 30 0 and the maximum size corresponds to a cone angle of 60 o . in the figure below, x is the width of the window, y is the height of the window and z is the distance from the hsdl-3612 to appendix c: optical port dimensions for hsdl-3612: the back of the window. the distance from the center of the led lens to the center of the photodiode lens, k, is 7.08mm. the equations for computing the window dimensions are as follows: x = k + 2*(z+d)*tana y = 2*(z+d)*tana the above equations assume that the thickness of the window is negligible compared to the distance of the module from the back of the window (z). if they are comparable, z' replaces z in the above equation. z' is defined as z'=z+t/n where t is the thickness of the window and n is the refractive index of the window material. the depth of the led image inside the hsdl-3612, d, is 8mm. a is the required half angle for viewing. for irda compliance, the minimum is 15 0 and the maximum is 30 0 . assuming the thickness of the window to be negligible, the equations result in the following tables and graphs: d z k a ir transparent window opaque material opaque material ir transparent window x y section of a castellation in y-axis.
23 aperture width aperture height (x, mm) (y, mm) module depth, (z) mm max. min. max. min. 0 16.318 11.367 9.238 4.287 1 17.472 11.903 10.392 4.823 2 18.627 12.439 11.547 5.359 3 19.782 12.975 12.702 5.895 4 20.936 13.511 13.856 6.431 5 22.091 14.047 15.011 6.967 6 23.246 14.583 16.166 7.503 7 24.401 15.118 17.321 8.038 8 25.555 15.654 18.475 8.574 9 26.710 16.190 19.630 9.110 aperture width (x) ?mm 30 module depth (z) ?mm 10 47 0 5 09 15 26 20 x max. x min. 25 135 8 aperture width (x) vs module depth aperture height (y) ?mm module depth (z) ?mm 10 47 0 5 09 15 26 20 y max. y min. 25 135 8 aperture height (y) vs module depth
window material almost any plastic material will work as a window material. polycarbonate is recommended. the surface finish of the plastic should be smooth, without any texture. an ir filter dye may be used in the window to make it look black to the eye, but the total optical loss of the window should be 10 percent or less for best optical performance. light loss should be measured at 875 nm. shape of the window from an optics standpoint, the window should be flat. this flat window (first choice) curved front and back (second choice) curved front, flat back (do not use) ensures that the window will not alter either the radiation pattern of the led, or the receive pattern of the photodiode. if the window must be curved for mechanical or industrial design reasons, place the same curve on the back side of the window that has an identical radius as the front side. while this will not completely eliminate the lens effect of the front curved surface, it will significantly reduce the effects. the amount of change in the radiation pattern is dependent upon the material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. once these items are known, a lens design can be made which will eliminate the effect of the front surface curve. the following drawings show the effects of a curved window on the radiation pattern. in all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm. 24
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (408) 654-8675 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152(domestic/international), or 0120-61-1280(domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ? 2003 agilent technologies, inc. obsoletes 5988-8423en april 30, 2003 5988-9349en

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